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A two-component 1: 1 thermally conductive silicone characterized by zero release of small molecules during the curing process and excellent thermal conductivity and good fluidity. It can be used for potting of electronic components such as high-power inverters, start-up power supplies, new energy vehicles, etc.

High thermal conductivity: 1.5-2.5 W / (m·K).

Low viscosity: 4000-15000 mPa·s.

Excellent aging performance.